EPE Solar Encapsulation Film
Advanced Protection Film for High-Efficiency Solar PV Modules
EPE (Encapsulation Polyolefin Elastomer) Solar Encapsulation Film is a next-generation polymer encapsulant designed to offer superior durability, stronger moisture resistance, and higher module reliability compared to conventional EVA films.
With excellent optical clarity, outstanding PID resistance, and strong mechanical performance, EPE film is ideal for high-performance, long-life solar PV modules across all climates.
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Key Features
Superior Moisture-Barrier Performance
Provides significantly better protection against humidity and water vapor—ideal for harsh and high-humidity environments.
Outstanding PID & UV Resistance
Enhanced resistance to Potential Induced Degradation (PID), UV exposure, and long-term aging, ensuring prolonged module efficiency.
Excellent Optical Transparency
Delivers high light transmission for maximum solar power generation.
Strong Adhesion & Mechanical Strength
Ensures firm bonding with glass, solar cells, and backsheet materials, minimizing delamination and improving module durability.
Low Shrinkage & Thermal Stability
Maintains dimensional stability during lamination; prevents cell shifting and ensures uniform encapsulation.
High Electrical Insulation
Improves overall module safety, preventing electrical leakage and performance drop.
Suitable for High-Power PV Modules
Designed for modern PV technologies including half-cut, mono-PERC, TOPCon, and bifacial modules.
Applications
- Crystalline Silicon Solar Modules
- Bifacial PV Modules
- High-Efficiency Mono-PERC / TOPCon Panels
- Thin-Film PV Modules
- Rooftop & Utility-Scale Solar Installations
- Solar Street Lights & Portable PV Products
- Harsh-weather installations (humidity, desert, coastal areas)
Technical Specifications
| Parameter | Typical Value |
|---|---|
| Thickness | 0.35–0.50 mm |
| Transparency | ≥ 92% |
| Water Vapor Transmission Rate | Very Low (Superior to EVA) |
| Gel Content | High, Stable Cross-Linking |
| Thermal Shrinkage | ≤ 2% |
| Elongation at Break | ≥ 800% |
| PID Resistance | Excellent |
| Volume Resistivity | ≥ 1×10¹⁴ Ω·cm |
| UV Cut-Off | ~360 nm |
| Lamination Temperature | 120–140°C |
| Lamination Time | 8–12 minutes |
Why Choose Us
- Superior moisture barrier vs EVA
- Enhanced PID & UV resistance
- Increased module lifespan (25+ years)
- Compatible with all mainstream cell technologies
- Improved mechanical and electrical reliability
- Designed for high-wattage and bifacial modules
